Sumitech’s precision machining process for semiconductor components mainly includes technical principles, process flow, and key processing technologies.

Firstly, from a technical perspective, the core of precision machining of semiconductor components lies in achieving size control and surface quality optimization at the micrometer or even nanometer level. This requires strict control of parameters such as temperature, pressure, and cutting force during the machining process to ensure that the machining accuracy and surface roughness meet the design requirements. At the same time, semiconductor materials such as silicon and gallium arsenide have unique physical and chemical properties, which also impose strict requirements on processing tools, cooling fluids, and processing environments.

Secondly, the precision machining process of semiconductor components is complex and intricate. Usually includes the following key steps: design preparation, which involves 3D modeling and simulation analysis based on product requirements to determine the size, shape, etc. of the parts; Next is the preparation of raw materials, such as heating and separating silica sand to obtain high-purity silicon materials; Then there are steps such as casting, cutting, and polishing to obtain finished wafers with a clean surface; Afterwards, oxidation and other treatments are required to form a protective film on the surface of the wafer.

In terms of key processing technologies, precision five axis machining technology is an important means of achieving high-precision machining of semiconductor components. This technology can achieve high-precision machining of complex curved parts through five axis linkage, meeting the stringent precision requirements of semiconductor components. At the same time, precision five axis machining technology can also improve machining efficiency, achieve one-time clamping and multi-faceted machining, and reduce the number of clamping times and processing time during the machining process.